ESIPS

Undertake a high-level investigative project for industry through the Engineering Sydney Industry Placement Scholarship

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Our Engineering Sydney Industry Placement Scholarship (ESIPS) is designed to enrich your learning through a six-month on-the-job experience as part of an industry team under the guidance of an industry mentor and academic supervisor.

What is the ESIPS program?

The ESIPS program is designed to place our highest achieving students studying either an undergraduate engineering degree* or Master of Professional Engineering within leading industry companies during their final year of studies.

Our goal is to enrich the student’s learning experience by immersing them in industry, whilst offering companies the opportunity to work with talented young minds at an early stage in their career.

Over the course of a six-month full-time industry placement, each student involved in the program undertakes a high-level investigative project, based on the needs of their partner organisation. The outcomes of this project will ultimately be presented to the partner organisation.

This industry placement also meets fourth-year course requirements, providing participating students with valuable work experience and six-months credit towards the completion of their engineering degree with no additional time added. 

Discover examples of previous high-level investigative projects (pdf, 219 KB) undertaken by our students on behalf of their partner organisations.

*ESIPS is unavailable to students studying a Bachelor of Advanced Computing or a Bachelor of Project Management.

Eligibility 

To be eligible to apply, you need to be a full-time enrolled student of the University.

To be successful, you will need to have completed all third-year core subjects and have an academic record and an approach to work and responsibilities which indicate that you have the potential of graduating with First Class Honours or equivalent.

You should be able to demonstrate strong interpersonal and communications skills, leadership qualities and self-motivation. ESIPS opportunities are advertised twice per year with successful students interviewed by both industry partner and academics before being awarded a scholarship.

Details

Semester dates:

  • Semester 1 – January – June
  • Semester 2 – June - December

Please contact us for upcoming industry placement opportunities or partnership enquiries via engineering.esips@sydney.edu.au.

ESIPS portal

for current students

ESIPS partnership information flyer

Filename
engineering-sydney-industry-placement-scholarship-flyer_2025.pdf
Title
ESIPS partnership information flyer
Size
146 KB
Format
application/pdf
Extension
pdf

Partner organisations

ESIPS has built long-term partnerships with world-leading and local innovative companies to provide students with networks and job readiness skills in deep-tech, solving cutting-edge sustainability, health or business challenges.